0.36mm 0.05mm [0.014" 0.002"] 1mm typ. 8mm [0.315"] 4.5mm [0.178"] 0.8mm typ. 13mm 1.6mm 1mm 1mm status: released drawing: a. evans scale: 8:1 rev: b date: 06/01/09 modified: 08/29/14 file: SF-BGA60G-B-61 dwg.mcd SF-BGA60G-B-61 drawing t o l e r a n c e s : diameters 0.03mm [0.001], pcb perimeters 0.13m m [0.005], pcb thicknesses 0.18mm [0.007"], pit ches (from true position) 0.08mm [0.003"], all other tolerances 0.13mm [0 .005] unless stated otherwise. materials and spec ifications are subject to change without notice. pins: material- brass alloy 360 1/2 hard; finish- 0.25m [10"] au over 1.27m [50"] ni (min.). substrate: 1.59mm 0.18mm [0.0625" 0.007"] fr4/g10 or equivalent high temp material; non-clad 2 1 top view side view d e s c r i p t i o n : giga-snap bga smt foot 60 position terminal pins (0.8mm x 1.0 mm centers, 6x12 array) to smt solder balls (bga type). pin asi gnment 1:1. ? 2009 ironwood electronics, inc. 11351 rupp drive, suite 400, burnsville, mn 55337 tele: (952) 229-8200 www.ironwoodelectronics.com 3 solder balls: eutectic 63 sn 37 pb
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